Support structure and method of forming a support structure

ABSTRACT

A structure for fixing a membrane to a carrier including a carrier; a suspended structure; and a holding structure with a rounded concave shape which is configured to fix the suspended structure to the carrier and where a tapered side of the holding structure physically connects to the suspended structure is disclosed. A method of forming the holding structure on a carrier to support a suspended structure is further disclosed. The method may include: forming a holding structure on a carrier; forming a suspended structure on the holding structure; shaping the holding structure such that it has a concave shape; and arranging the holding structure such that a tapered side of the holding structure physically connects to the suspended structure.

RELATED APPLICATION(S)

This application is a divisional of U.S. patent application Ser. No.14/198,646, filed Mar. 6, 2014, entitled “SUPPORT STRUCTURE AND METHODOF FORMING A SUPPORT STRUCTURE”, the contents of which are incorporatedherein by reference in their entirety.

TECHNICAL FIELD

Various embodiments relate to a graded structure for fixing a membraneto a carrier and to a method for manufacturing the graded structure.

BACKGROUND

The ability to produce thin membranes that are able to withstandrepeated cycles of high physical displacement is essential to theproduction and further miniaturization of a variety ofmicro-electro-mechanical system (MEMS) transducers. These MEMStransducer systems are integrated into a wide array of portableelectronic devices. In most of the portable electronic devices that usethese MEMS transducer systems, miniaturization is essential tocommercial success. Many of these systems, particularly transducersbased on the detection and/or generation of membrane deflection due to areceived signal or an electrical input, require that a very thinmembrane be suspended between several support structures in order tooperate.

SUMMARY

In accordance with various embodiments, a structure for fixing amembrane to a carrier is disclosed. The structure may include: acarrier; a suspended structure; and a holding structure configured tofix the suspended structure to the carrier. The holding structure mayhave a rounded, concave shape and a tapered side of the holdingstructure may physically connect to the suspended structure.

BRIEF DESCRIPTION OF THE DRAWINGS

In the drawings, like reference characters generally refer to the sameparts throughout the different views. The drawings are not necessarilyto scale, emphasis instead generally being placed upon illustrating theprinciples of the invention. In the following description, variousembodiments of the invention are described with reference to thefollowing drawings, in which:

FIG. 1A shows a cross sectional view of a MEMS microphone;

FIG. 1B shows a close-up, cross-sectional view of a currently availablestrategy for dealing with stresses imposed on a membrane by the fixingmeans used to attach a membrane to a carrier. The current solutionincludes using at least two materials with different etching rates suchthat, when the materials are etched, a long tapered structure isproduced which thereby reduces the stress on the membrane

FIG. 2 shows a structure in accordance with various embodiments.

FIG. 3 shows a structure in accordance with various embodiments.

FIG. 4 shows an embodiment where multiple structures, as shown in FIG.2, have been formed on top of one another to create a multi-membranestack structure.

FIG. 5 shows a flow diagram illustrating a method of forming a structurein accordance with various embodiments.

FIG. 6 shows a cross sectional view of a MEMS pressure sensor orpressure sensing system in accordance with various embodiments.

FIG. 7 shows a cross sectional view of a MEMS speaker or speaker systemin accordance with various embodiments.

DESCRIPTION

The following detailed description refers to the accompanying drawingsthat show, by way of illustration, specific details and embodiments inwhich the invention may be practiced.

The word “exemplary” is used herein to mean “serving as an example,instance, or illustration”. Any embodiment or design described herein as“exemplary” is not necessarily to be construed as preferred oradvantageous over other embodiments or designs.

The word “over” used with regards to a deposited material formed “over”a side or surface, may be used herein to mean that the depositedmaterial may be formed “directly on”, e.g. in direct contact with, theimplied side or surface. The word “over” used with regards to adeposited material formed “over” a side or surface, may be used hereinto mean that the deposited material may be formed “indirectly on” theimplied side or surface with one or more additional layers beingarranged between the implied side or surface and the deposited material.

Various embodiments relate generally to a structure for fixing amembrane on a carrier while reducing the stress imposed on the membraneat the fixing points and a method for forming the fixing structure.

FIG. 1A is a schematic representation of a perspective cross sectionalview of a MEMS microphone 10. In the MEMS microphone 10, the activeareas may include a very thin membrane 100, e.g. having a thickness of afew hundred nanometers, as well as a counter electrode 102 suspendedover a cavity 105 formed in substrate 104.

In the MEMS microphone 10, the substrate 104 may be a semiconductorsubstrate, e.g. a substrate includes or essentially consists of silicon,germanium, silicon germanium, gallium nitride, gallium arsenide, orother elemental and/or compound semiconductors (e.g. a III-V compoundsemiconductor such as e.g. gallium arsenide or indium phosphide, or aII-VI compound semiconductor or a ternary compound semiconductor or aquaternary compound semiconductor) as are appropriate for a givenapplication.

In various embodiments of the MEMS microphone 10, the membrane 100 maybe a semiconductor membrane, e.g. a silicon, poly-silicon, and/or asilicon nitride membrane. The membrane 100 may include or essentiallyconsist of various other semiconductor materials as necessary for agiven application. Further, the membrane 100 may be at least partiallymetalized.

In various embodiments of the MEMS microphone 10, the counter electrode102 may at least partially include or essentially consist of asemiconductor material, e.g. silicon, that may be at least partiallymetalized. In some embodiments, the counter electrode 102 may be metalor may include a metal layer, e.g. copper or a copper layer.

The MEMS microphone 10 with the membrane 100 may be etched from abackside 104 a of the substrate 104, wherein the backside 104 a may beopposite the side (which may be referred to as a frontside 104 b of thesubstrate 104) on which the counter electrode 102 is provided. Thecounter electrode 102 may be very thin, e.g. having a thickness in therange from about 100 nm to about 1 μm, e.g. in the range from about 100nm to about 250 nm, e.g. in the range from about 250 nm to about 500 nm,e.g. in the range from about 500 nm to 1 about μm. Acoustic wavesimpinging on the membrane 100 may cause the membrane 100 to oscillate.The acoustic waves may be detected by measuring the capacitance changedue to the oscillation of the membrane 100. In other words, as thedistance between membrane 100 and counter electrode 102 may vary, thecapacitance generated may also vary. The performance of the MEMSmicrophone 10 may depend on a volume and a shape of a cavity 105 formedfrom the backside 104 a of the substrate 104 exposing a backside 100 aof the membrane 100, i.e. the side opposite a frontside 100 b of themembrane 100, which acoustic wave impinge on. One barrier to theminiaturization of the MEMS microphone 10 may be a stress imposed on themembrane 100 during oscillation, e.g. at fixing points, at which themembrane 100 is mounted (in other words fixed) to the substrate 104.This may lead to a membrane fracture and a premature failure of the MEMSmicrophone 10. The stress may be of particular concern at the fixingpoints 107, where the membrane 100 is fixed to the substrate 104.

Currently available strategies and devices for reducing the stress atthe fixing points 107 involve, as illustrated in FIG. 1B, a taperedsupport structure which includes or essentially consists of two or morematerials e.g. 108 and 110, with different etch rates such that when thematerials are etched, the taper is formed.

A first membrane support material 110, may have a thickness ranging from100 nm to 800 nm, e.g. from 100 nm to 250 nm, e.g. from 250 nm to 500nm, e.g. from 500 nm to 800 nm. A second membrane support material 108may have a thickness ranging from 150 nm to 300 nm. The first membranesupport material 110 may be silicon oxide SiO₂. The second membranesupport material 108 may be silicon oxynitride (SiON). The result may bethe creation of a two-layer structure including oxide (SiO₂) andoxynitride. If various isotropic wet-etching techniques are used,etching rate of SiO₂ will be higher than that of SiON. One possibleresult of this process is a triangular overhang 112 of SiON, as shown inFIG. 1B.

In the configuration shown in FIG. 1B, the membrane 115 usually has athickness ranging from 250 nm to 400 nm.

The tapered support structure consisting of membrane support structures108 and 110, mitigates the initial stress on the membrane 115 at thefixing points 107 by distributing the stress into two lower stress zones106. However, the abrupt transitions and/or corners or edges in thelower stress zones 106 still present areas where stress may be imposedon the membrane 115.

The current disclosure may provide an improved clamping and/or supportstructure for attaching thin membranes to a substrate or carrier. Thecurrent disclosure may also provide for a method of producing theimproved clamping device. The clamping structure of the presentdisclosure may eliminate the abrupt transitions or edges, present incurrently available solutions, e.g. by implementing a support structurethat has a gradually curved, concave, tapered shape instead of thesharp, angular tapered shapes available with current technology and/ortechniques. Structures and methods provided in accordance with variousembodiments may reduce or eliminate at least some of the disadvantagespresent in current membrane clamping techniques.

In accordance with various embodiments, a structure for clamping orfixing a membrane to a carrier in a MEMS transducer or transducer systemis disclosed.

According to various embodiments, the structure for clamping or fixingthe membrane 100 to the substrate 104 (in other words carrier) may be aholding structure 202, formed on a carrier 104, as illustrated in FIG.2.

According to various embodiments, at least one side of the holdingstructure 202 may have a tapered, concave shape, as illustrated in FIG.3. If the membrane 100 deflects or deforms due to a given force, e.g. asound wave, the tapered, concave shape of the holding structure 202 maymitigate any stress that may be imposed on the membrane 100 by theholding structure 202 during a membrane deflection. For example, if thetapered structure was implemented in a MEMS microphone, when themembrane 100 oscillates and deforms in a direction F1, due to anincident sound wave, any stress imposed on the membrane 100 by theholding structure 202 may be distributed across the curved surface C1,instead of being concentrated in a few high-stress zones as withcurrently available solutions.

The holding structure 202 may be deposited on the carrier 104 by meansof various fabrication techniques, e.g. physical vapor deposition,electrochemical deposition, chemical vapor deposition, molecular beamepitaxy, and atomic layer deposition. According to various embodiments,the carrier 104 may include or may include or essentially consist ofmaterial appropriate for a given application, for example asemiconductor material such as including or essentially consisting ofgermanium, silicon germanium, silicon carbide, gallium nitride, galliumarsenide, indium, indium gallium nitride, indium gallium arsenide,indium gallium zinc oxide, or other elemental and/or compoundsemiconductors. The carrier 104 may also include other materials orcombinations of material, for example various dielectrics, metals andpolymers as are appropriate for a given application. The carrier 104 mayfurther include or may include or essentially consist of, for example,glass, and/or various polymers. According to at least one embodiment,the carrier 104 may be a silicon-on-insulator (SOI) carrier.

According to various embodiments, a thickness T1 of holding structure202 may be, e.g. in the range from about 100 nm to 1 μm, e.g. from about100 nm to 250 nm, e.g. from about 250 nm to 500 nm, e.g. from about 500nm to 1 μm. According to at least one embodiment, the membrane 100 maybe deposited onto the holding structure 202 after the holding structure202 is deposited on the carrier 104. The suspended structure 100 may bedeposited onto the holding structure 202 through various fabricationtechniques, e.g. physical vapor deposition, electrochemical deposition,chemical vapor deposition, molecular beam epitaxy, and atomic layerdeposition.

According to various embodiments, a thickness T2 of the membrane 100 maybe, e.g. in the range from about 300 nm to 1 μm, e.g. from about 300 nmto 400 nm, e.g. from about 400 nm to 500 nm, e.g. from about 500 nm to 1μm.

According to various embodiments, the membrane 100 may be asemiconductor membrane, e.g. a silicon membrane. The membrane 100 mayinclude or essentially consist of various other semiconductor materialsas necessary for a given application. For example, the membrane 100 mayinclude or essentially consist of germanium, silicon germanium, siliconcarbide, gallium nitride, gallium arsenide, indium, indium galliumnitride, indium gallium arsenide, indium gallium zinc oxide, or otherelemental and/or compound semiconductors.

According to various embodiments, the membrane 100 may include oressentially consist of or may include at least one of a dielectricmaterial, a piezoelectric material, a piezoresistive material, aferroelectric material, and various metals.

According to various embodiments, the concave, tapered shape of holdingstructure 202 may be obtained through an etching process that does notetch the membrane 100. Such a continuously varying and/or graded etchprocess may be achieved by varying the material composition of holdingstructure 202 such that the etch rate at point E1 on holding structure202 is lower than the etch rate at point E2. Various etching techniquesmay be used to obtain the tapered shape of holding structure 202, e.g.isotropic gas phase etching, vapor etching, wet etching, isotropic dryetching, plasma etching, etc. For example, the concave, tapered shape ofholding structure 202 may be obtained through an etching process wherethe etching rate of the holding structure 202 is not constant throughoutthe material. This effect may be achieved, for example, by composingholding structure 202 of a silicon oxinitride compound and etching theholding structure 202 with a fluoridic acid while varying or grading thenitrogen content X in the silicon oxinitride such that the chemicalcomposition of the silicon oxinitride may be defined by SiO_(1-x)N_(x).According to various embodiments, a silicon oxinitride compound with avarying nitrogen content may be produced through the use of variousfabrication techniques, e.g. physical vapor deposition, electrochemicaldeposition, chemical vapor deposition, molecular beam epitaxy, andatomic layer deposition. For example, by controlling and/or varying thenitrogen content of the material being deposited, the deposited siliconoxinitride material may have a nitrogen content that is continuouslyvaried and/or graded throughout the material e.g. ranging from a lowconcentration of nitrogen at the point E2 to a higher concentration ofnitrogen at the point E1. In various embodiments, the low concentrationof nitrogen at the point E2 may be in the range from about 0% to about100%, e.g. in the range from about 40% to about 80%. Furthermore, thehigher concentration of nitrogen at the point E1 may be in the rangefrom about 50% to about 100%, e.g. in the range from about 10% to about50%.

The holding structure thus illustratively may include a first materialand a second material different from the first material. Theconcentration of the second material in the first material may becontinuously varied as a function of location within the first materialrelative to the carrier.

According to various embodiments, the point E1 of holding structure 202may be arranged at a top surface 202 b of the holding structure 202, inother words, according to various embodiments, the point E1 may belocated in the portion of holding structure 202 which may be fixed tothe backside 100 a of the membrane 100. According to variousembodiments, the point E1 of holding structure 202 may be arranged on aside of the holding structure 202 which may be overhung and/or enclosedby the membrane 100 and adjacent to the cavity 105, i.e. a side and/orface of the holding structure 202 which may be nearest to the cavity105.

According to various embodiments, the point E2 in holding structure 202may be arranged at a bottom surface 202 a of the holding structure 202,in other words, according to various embodiments, the point E2 may belocated in the portion of holding structure 202 which is fixed to thefrontside 104 b of the substrate 104. According to various embodiments,the point E2 of holding structure 202 may be arranged on a side ofholding structure 202 which may be overhung and/or enclosed by themembrane 100 and adjacent to the cavity 105, i.e. a side and/or face ofthe holding structure 202 which may be nearest to the cavity 105.

According to various embodiments, many different semiconductor materialsmay be used in conjunction with the variable etch rate as describedabove. For example, the tapered shape described above may be obtained bycomposing the holding structure 202 of at least one of silicongermanium, gallium arsenide, silicon carbide, gallium nitride, galliumarsenide, indium, and other elemental and/or compound semiconductors andthen etching the compound with various anisotropic wet etching agentssuch as various phosphoric acid solutions such as e.g. hydrofluoric acid, various oxide solutions, e.g. tetramethylammonium hydroxide, andethylenediamine pyrocatechol. The semiconductor materials may likewisebe etched through the use of various isotropic agents. According tovarious embodiments, plasma etching may also be used in the variableetch rate process as described above. According to various embodiments,the tapered shape described above may be obtained by composing theholding structure 202 of various other materials, e.g. a metallicmaterial, various metal alloys and/or compound metals, and variouselemental metals as may be desirable for a given application.

According to various embodiments, the tapered shape described above maybe obtained by composing the holding structure 202 of several differentmaterials, each with slightly differing etch rates and arranging thematerials such that, when etched, the tapered shape described above maybe formed. In other words, the holding structure 202 may be implementedas a type of composite and/or laminate structure of a plurality ofdifferent materials, where each material in the composite structure mayhave a slightly different etch rate from the other materials used toimplement the composite structure. According to various embodiments,only one type of etchant and/or only a single etching step may benecessary to shape the holding structure 202 into the tapered shapedescribed above. In various embodiments where the holding structure 202may be implemented as a type of composite structure, the tapered shapedescribed above may be achieved by arranging the various materials inthe composite structure such that, when etched, the tapered shape isachieved. In various embodiments where the holding structure 202 may beimplemented as a type of composite structure, the composite structuremay be produced through the use of various fabrication techniques, e.g.physical vapor deposition, electrochemical deposition, chemical vapordeposition, molecular beam epitaxy, and atomic layer deposition.

According to various embodiments, as illustrated in FIG. 3, after thegraded holding structure 202 has been formed, stress imposed on membrane100 may be distributed or disbursed across the entire span of the curvedsection C1, instead of being concentrated in stress zones 106 as withvarious currently available technologies. The graded holding structure202 may be implemented as a type of rounded arch or vaulted supportstructure.

According to various embodiments, as illustrated in FIG. 4, a furthergraded holding structure 402 may be formed on the frontside 100 b ofmembrane 100 and a further membrane 400 may be formed on a top side 402a of the further holding structure 402. The further holding structure402 may be formed through a similar process used to form holdingstructure 202, as described above. For example, the material compositionof the further holding structure 402 may be configured such that theetch rates at points E3 and E5, respectively, on holding structure 402are lower than the etch rate at point E4.

According to various embodiments, the point E3 of the further holdingstructure 402 may be arranged at the top side 402 a of the furtherholding structure 402, in other words, according to various embodiments,the point E3 may be located in a portion of the further holdingstructure 402 which may be fixed to a backside 400 a of the furthermembrane 400. According to various embodiments, the point E3 of thefurther holding structure 402 may be arranged on a side of the furtherholding structure 402 which may be overhung by the further membrane 400and may be between and/or may be bracketed by the frontside 100 b ofmembrane 100 and the backside 400 a of the further membrane 400,respectively.

According to various embodiments, the point E5 of the further holdingstructure 402 may be arranged at the frontside 100 b of membrane 100, inother words, according to various embodiments, the point E5 may belocated in a portion of the further holding structure 402 which may befixed to the frontside 100 b of membrane 100. According to variousembodiments, the point E5 of the further holding structure 402 may bearranged on a side of the further holding structure 402 which may beoverhung by the further membrane 400 and may be between and/or may bebracketed by the frontside 100 b of membrane 100 and the backside 400 aof the further membrane 400, respectively.

According to various embodiments, the point E4 of the further holdingstructure 402 may be arranged at a given point between points E3 and E5on a surface of the further holding structure 402 which may be nearestto the cavity 105. For example, according to various embodiments thepoint E4 may be co-located with either point E3 or E5; according tovarious embodiments point E4 may be located equidistant between pointsE3 and E5; according to various embodiments point E4 may be located atany point between points E3 and E5 on the further holding structure 402as may be desired for a given application. According to variousembodiments, the point E4 may be located in a portion of the furtherholding structure 402 which may be arranged on a side of the furtherholding structure 402 which is overhung by the further membrane 400 andmay be between and/or may be bracketed by the frontside 100 b ofmembrane 100 and the backside 400 a of the further membrane 400,respectively.

According to various embodiments, as illustrated in FIG. 4, the furthergraded holding structure 402 and the further membrane 400 may beimplemented as a stack and/or stacked structure in conjunction withgraded holding structure 202 and membrane 100. According to variousembodiments, additional holding structures and membranes (not shown) maybe added to this stack structure through the use of a method similar tothat describe above. According to various embodiments the stackstructure may contain as many additional holding structures andmembranes as may be desired for a given application.

According to various embodiments, the curved section C1, as illustratedin FIG. 3, may defined as a circular or substantially circular shapedsection. In various embodiments, curved section C1 may be an ellipticalor substantially elliptical shaped section. In various embodiments, thecurved section C1 may be parabolic or substantially parabolic in shape.In various embodiments, the curved section C1 may be hyperbolic orsubstantially hyperbolic in shape. In various embodiments, the radius ofcurvature of section C1 may be adjusted as is desired to define theshape for a given application.

According to various embodiments, the holding structure 202 may beimplemented in a MEMS structure, e.g. in a anchored MEMS structure.

According to various embodiments, the holding structure 202 may beimplemented in a MEMS microphone or microphone system.

According to various embodiments, as illustrated in FIG. 5, a method 500of forming a holding structure on a carrier to support a suspendedstructure is disclosed. The method 500 may include, as indicated in 502,forming a suspended structure over a carrier; forming a holdingstructure, as indicated in 504 to fix the suspended structure to thecarrier; the method 500 may further include, as indicated in 506,shaping the holding structure such that it has a concave shape. Themethod 500 may further include, as indicated in 508, arranging theholding structure such that a tapered side of the holding structure mayphysically connect to the suspended structure.

According to various embodiments, the holding structure 202 may beimplemented in a MEMS pressure sensor or pressure sensing system. Forexample, as illustrated in FIG. 6, a MEMS pressure sensor configuration600 which may use a substrate structure 602 with a pressure cavity 604formed therein; a diaphragm element 606 suspended across the pressurecavity 604; and a reference element 608 likewise suspended across thepressure cavity 604 and arranged such that it is parallel to thediaphragm element 606; to create a variable capacitor which may detectdeflection of the diaphragm element 606 due to an applied pressure overan area of the diaphragm element 606. The diaphragm element 606 in thistype of MEMS pressure sensor may be subject to similar types of stress(discussed above) as experienced by the membrane 100, particularly inthe areas where the diaphragm may be secured or fixed to the substratestructure.

In various embodiments, the structure may be configured as a speaker,e.g. a MEMS speaker system, which may be actively driven. This will beexplained in more detail below.

According to various embodiments, the holding structure 202 may beimplemented in a MEMS speaker or speaker system. For example, asillustrated in FIG. 7, a MEMS speaker assembly 700 may include a movableoscillator element 702 (in other words a membrane) suspended from asupport structure 704 formed in a substrate structure 706. The MEMSspeaker assembly may further include a magnetic material 708 attached tosaid oscillator element 702 and supported by a support layer 710 and anelectrically conductive coil 712 which may surround the magneticmaterial 708. If an electric current flows through said conductive coil712, the magnetic material 708 may be displaced. The magnitude and/ordirection of said electric current in the conductive coil 712 determinesthe extent to which the magnetic material 708 may be displaced. Thedisplacement of the magnetic material 708 may cause the oscillatorelement 702 to move and the movement may produce sound waves that are ofsufficient magnitude and appropriate frequencies to be detected by thehuman ear. In the MEMS speaker, the oscillator element 702 may besubjected to stress due to oscillation whenever the device is operating.This may subject the oscillator element 702 to similar types of stress(discussed above) as experienced by the membrane 100, particularly inthe areas where the oscillator element may be secured or fixed to thesupport layer in the substrate structure. In another example (notshown), the MEMS speaker assembly 700 may be implemented as apiezoelectric micro-speaker. A typical piezoelectric micro-speaker maycontain a membrane structure suspended over pressure cavity. Themembrane structure may contain a piezoelectric actuator material, suchas e.g. AlN or PZT. When a voltage is applied across the piezoelectricactuator, it deforms and or vibrates and produces sound waves. Thisvibration may subject the membrane structure to similar types of stress(discussed above) as experienced by the membrane 100, particularly inthe areas where the the membrane structure may be secured or fixed atthe edge of the pressure cavity.

According to various embodiments, the holding structure 202 may beimplemented in various MEMS switches or switching system.

According to various embodiments, a structure is disclosed. Thestructure may include a carrier 104, a suspended structure 100, and aholding structure 202 configured to fix or attach the suspendedstructure 100 to the carrier 104 where the holding structure 202 mayhave a concave shape and a tapered side 202 c of the holding structure202 may physically connect to the suspended structure 100.

According to various embodiments, a surface of the holding structure 202is fixed to a surface of the carrier 104. In at least one embodiment,the bottom surface 202 a of the holding structure 202 may be fixed to atop surface 104 a of the carrier 104.

According to various embodiments, a surface of the suspended structure100 is fixed to a surface of the holding structure 202. In variousembodiments, a backside 100 a of the suspended structure 100 may befixed to the top surface 202 b of the holding structure 202.

In various embodiments, the carrier 104 may be a semiconductorsubstrate.

In various embodiments, the carrier 104 may be a silicon-on-insulator(SOI) substrate.

In various embodiments, the carrier 104 may be a glass substrate.

In various embodiments, the holding structure 202 further includes afirst material and a second material. In various embodiments, theconcentration of the second material in the first material may becontinuously varied as a function of location within the first materialrelative to the carrier 104.

In various embodiments, at least one of the first material and thesecond material may be a semiconductor material.

In various embodiments, at least one of the first material and thesecond material may be a dielectric material.

According to various embodiments, at least one of the first material andthe second material may be metal.

According to various embodiments, the suspended structure 100 may be amembrane material.

According to various embodiments, the membrane material may be asemiconductor membrane material.

According to various embodiments, the membrane material may be aferroelectric membrane material.

According to various embodiments, the membrane material may be apiezoelectric membrane material.

According to various embodiments, a method of forming a holdingstructure 202 on a carrier 104 to support a suspended structure 100 isdisclosed. The method may include forming a suspended structure 100 overa carrier 104; forming a holding structure 202 to fix the suspendedstructure 100 to the carrier 104; where the holding structure 202 has aconcave shape and a tapered side of the holding structure 202 and mayphysically connect to the suspended structure 100.

According to various embodiments, the method may include a holdingstructure 202 that is shaped after the suspended structure 100 is formedon the holding structure 202.

According to various embodiments, the method may include a holdingstructure 202 that is shaped by an etching process such that the etchingprocess does not etch the suspended structure 100.

According to various embodiments, the method may include that the shapeof the holding structure 202 is determined by a first material and asecond material, wherein the second material is introduced into, e.g.diffused into the first material and the concentration of the secondmaterial in the first material is continuously varied as a function oflocation within the first material relative to the carrier 104. Invarious embodiments, the holding structure 202 may be compositionallygraded. In various embodiments, the holding structure 202 may enable acurved etching, in other words different areas having different etchingrates with respect to the same etchant. In various embodiments, theholding structure 202 may include a composite of two or more materialsto provide the holding structure 202 compositionally graded. The holdingstructure 202 may e.g. include of essentially consist of silicon oxide(SiO_(x)) and/or silicon nitride (Si_(x)N_(y)) and/or silicon oxynitride(SiO_(x)N_(y), with varying x and y).

In various embodiments, a structure is provided. The structure mayinclude a carrier, a suspended structure, and a holding structureconfigured to fix the suspended structure to the carrier. The holdingstructure may be compositionally graded.

While the disclosure has been particularly shown and described withreference to specific embodiments, it should be understood by thoseskilled in the art that various changes in form and detail may be madetherein without departing from the spirit and scope of the invention asdefined by the appended claims. The scope of the disclosure is thusindicated by the appended claims and all changes which come within themeaning and range of equivalency of the claims are therefore intended tobe embraced.

What is claimed is:
 1. A method of forming a structure, the methodcomprising: forming a suspended structure over a carrier; forming aholding structure to fix the suspended structure to the carrier; whereinthe holding structure has a concave shape; wherein a tapered side of theholding structure physically connects to the suspended structure.
 2. Themethod of claim 1, wherein forming the holding structure comprisesshaping the holding structure to have a concave shape.
 3. The method ofclaim 1, wherein the structure is part of a MEMS structure.
 4. Themethod of claim 2, wherein the holding structure is shaped after thesuspended structure is formed on the holding structure.
 5. The method ofclaim 1, wherein forming the holding structure comprises performing anetching process.
 6. The method of claim 5, wherein the etching processis performed so that the etching process does not etch the suspendedstructure.
 7. The method of claim 5, wherein forming the holdingstructure comprises forming the holding structure with a first materialand a second material different from the first material so that aconcentration of the second material in the first material iscontinuously varied as a function of location within the first materialrelative to the carrier.
 8. The method of claim 7, wherein the firstmaterial and/or the second material is a semiconductor material.
 9. Themethod of claim 7, wherein the first material is silicon oxynitride andthe second material is nitrogen.
 10. The method of claim 7, wherein thefirst material and/or the second material is a dielectric material. 11.The method of claim 7, wherein the first material and/or the secondmaterial is a metal.
 12. The method of claim 1, wherein the holdingstructure comprises a concave sidewall having a circular orsubstantially circular shape, an elliptical or substantially ellipticalshape, a parabolic or substantially parabolic shape, or a hyperbolic orsubstantially hyperbolic shape.
 13. The method of claim 1, wherein thetapered end of the holding structure attaches to a bottom surface of thesuspended structure.
 14. The method of claim 1, wherein the carriercomprises a silicon-on-insulator substrate or a glass substrate.
 15. Themethod of claim 1, wherein the suspended structure comprises membranematerial.
 16. A method for manufacturing a structure, the methodcomprising: forming a holding structure over a carrier, wherein formingthe holding structure comprises varying the material composition of theholding structure, so that an etch rate of the holding structure varieswhen etching the holding structure; removing a portion of the holdingstructure comprising etching the holding structure with at least twodifferent etch rates so as to form a holding structure with a concavesidewall and a tapered end; and forming a suspended structure over theholding structure, wherein the holding structure fixes the suspendedstructure to the carrier.
 17. The method of claim 16, wherein etchingthe holding structure comprises: etching the holding structure with afirst etching rate at a point of the holding structured fixed to theback side of the suspended structure, the back side of the suspendedstructure facing the holding structure, and etching the holdingstructure with a second etching rate at a point of the holding structurefixed at a front side of the carrier, the front side of the carrierfacing the suspended structure, wherein the first etching rate is lowerthan the second etching rate.
 18. A method of forming a structure, themethod comprising: forming a suspended structure over a carrier, thecarrier comprising a cavity; forming a holding structure to fix thesuspended structure to the carrier, wherein the holding structurecomprises a concavely curved sidewall that extends from a top surface ofthe carrier to a tapered end of the holding structure; wherein the topsurface of the carrier faces toward the suspended structure, wherein thesidewall of the holding structure is laterally disposed at leastpartially outside the cavity.
 19. The method of claim 18, wherein abottom surface of the holding structure is attached to the top surfaceof the carrier, and wherein a bottom surface of the suspended structureis fixed to a top surface of the holding structure.
 20. The method ofclaim 19, wherein at least a portion of the bottom surface holdingstructure is exposed through the cavity of the carrier.